Surface technology

The surface of a circuit, and therefore its surface technology, have a decisive impact on the function and the quality of a printed circuit board. In high-frequency technology in particular, the choice of the finishing process has a significant impact on achieving the proposed design parameters.

Our in-house processes such as ENIG, ENIPIG or HAL and long-term cooperation with the leading specialists in Europe, enable us to offer all the techniques required by the market.

VARIOPRINT offers a wide range of specialised surfaces for all technological requirements. Whether special surface finishes for bonding processes or hard gold alloys for slip rings - we will always have the right solution for your requirements. 

Current status VARIOPRINT

  • Galvanic Nickel Gold
    Solderable and bondable (Goldwire)
  • Electroless Nickel / Immersion Gold (ENIG)
    Solderable and bondable (Aluwire)
  • Immersion silver / immersion gold (ISIG)
    Solderable and bondable (Goldwire)
    Nickel-free surface, therefore particularly suitable for high frequency products
  • Electroless palladium / semi-autocatalytic gold (EPIG)
    Solderable and bondable (Goldwire)
    Nickel-free surface, therefore particularly suitable for high frequency products
  • Electroless nickel / palladium / gold (ENEPIG or ENIPIG)
    Solderable and bondable (Goldwire)
  • Electroless tin
    Solderable
    Nickel-free surface, therefore particularly suitable for high frequency products
  • Immersion Silver
    Solderable
    Nickel-free surface, therefore particularly suitable for high frequency products
  • OSP (Entek Plus 106 A (X))
    Solderable
    Nickel-free surface, therefore particularly suitable for high frequency products