Actively helping to fashion technology trends based on market requirements. Flexible and rigid-flexible PCBs made by VARIOPRINT
Flexible and rigid-flexible circuit boards are becoming increasingly popular thanks to their versatility. Rigid-flex circuit boards have a long-standing tradition in aerospace technology and military electronics. Today, it is also impossible to imagine medical and industrial electronics without them.
Being extraordinarily versatile when it comes to layout options and geometries, they have found a firm place in today's packaging technology. This technology enables the reliability of assemblies to be significantly improved while reducing the installation costs.
With our flexible and rigid-flex circuit boards, customised to your individual requirements for assembly bending or lasting bending stress, you benefit from products of the highest quality.
Whether for connecting moveable parts or simply due to a lack of space, flexible and rigid-flex circuit boards from Varioprint may be the ideal solution for your application.
Our engineering team can support you in implementing your requirements from prototype to series production.
|Design and technology|
Multilayer circuits with symmetrical and asymmetrical structure. Semi-flex (for assembly bending) and full-flex design (for lasting bending) with a vast choice of materials.
Blind vias, buried vias, μ-vias with and without copper fill and plugged vias with/without overplating.
| Dimension and formats|
Thickness 0.1 mm to 4.8 mm
Format up to 420x569 mm
Panel formats used
305x460 mm and 460x610 mm
| Solder resists and additional prints|
Photo-sensitive solder mask in different colours, applied by spray coating and screen printing
Conductive pattern structuring
TG 135 °C and high TG 170 °C FR4
Halogen-free materials PTFE materials
Polyimide (Kapton) and special materials such as LCP (Liquid Crystal Polymers)
| End surfaces|
Various chemical and galvanic gold surfaces and chemical tin and silver surfaces, as well as pure organic protective coatings.
|Electroplating and copper plating |
Aspect ratio of up to 1:12 with 0.15 mm drill diameter
1:15 at 0.3 mm drill diameter
Copper in vias in accordance with IPC II, IPC III or customer-specific